Přehled vývoje epoxidových práškových barev

Epoxidová pryskyřice
Epoxy resin curing agents have developed rapidly, and many new high-performance curing agents have emerged. The Epon HPT curing agents 1061 and 1062 developed by Shell Company do not contain ether bonds in their molecular structure, but contain more hydrocarbon groups, which can improve water resistance and heat resistance. The curing agent and bisphenol A epoxy resin can achieve a curing product Tg of 207°C, and the water absorption is 1.4% to 1.6%. Ajicure PN-31 and PN-40 are latent curing agents; they are stable below 90°C and can be cured at 90°C. The storage period of the one-component epoxy adhesive prepared with them is more than 9 months. The nitrogen-containing phenolic resin (ATN) synthesized by Dainippon Ink and Chemicals with phenol, formaldehyde and melamine is used as a curing agent for epoxy resin. It has good flame retardancy and can reach UL94 V-O level. The adduct obtained by reacting spirocyclic diamine (ATU) with various epoxides and acrylonitrile is liquid at room temperature. It has a long application period as an epoxy resin curing agent, has no strict measurement requirements, is easy to use, and is almost non-toxic. The cured product is tough, has a small shrinkage rate, high bonding strength, a tensile strength of 65 to 80 MPa, and an impact strength of 14 to 16 kJ/㎡. The aromatic ether ester diarylamine obtained by reacting tetrabromobisphenol A bis (2-hydroxyethyl) ether with p-nitrobenzoyl chloride is used as an epoxy resin curing agent. The cured product has high strength, high toughness, high heat resistance, and low water absorption. The tensile strength is 95 MPa, the elongation at break is >12% a absorpce vody je<1.3%. In recent years, Japan has developed hydrogenated methylnadic anhydride (H-MNA), which cures bisphenol A epoxy resin at 162°C. Its heat aging time is 1.5 times that of MNA and MeTHPA, and its bending strength remains almost unchanged after 30 days at 200°C. In order to meet the requirements of moisture and heat resistance of electronic packaging materials, a variety of moisture and heat resistant curing agents have been developed, mainly containing phenolic resin structures. HardeneHY940 developed by Cibaeigy is a modified low molecular weight polyamide latent curing agent. After mixing with liquid epoxy resin, it has a storage period of 6 months at room temperature, high reactivity at 100°C, and excellent adhesion and mechanical properties. Shenyang Southeast Chemical Research Institute has recently developed and produced T-99 ultra-flexible multifunctional epoxy curing agent, which is colorless, transparent, non-toxic and environmentally friendly. It can cure epoxy resin at room temperature or by heating. Its cured product has an elongation at break of more than 200%, which is the best. It has solved the brittleness problem of epoxy resin cured by amine curing agents, which has been confusing for the first time, and has greatly broadened the application field of epoxy resin adhesives. Southeast Chemical Research Institute has successfully developed the HTAC series of modified anhydride curing agents, which are made by modifying methyltetrahydrophthalic anhydride. The cured products have excellent toughness and heat resistance (impact strength 24kJ/㎡, glass transition temperature Tg is 120℃). It has also successfully developed weather-resistant toughened anhydride curing agents, which are toughened and modified by methylhexahydrophthalic anhydride. There are no double bonds in the molecular structure and it has good weather resistance. Humtsman has developed a new type of fast polyetheramine curing agent Jeffamine XTJ-590, which cures about 4 times faster than ordinary polyetheramine D-230. It can be used alone or mixed with ordinary polyetheramines to cure epoxy resins. The cured products are light in color and have high impact strength and heat shock resistance. Air Products has recently launched water-based epoxy resin curing agents Anquanmine 721 and 731, which have excellent performance and environmental friendliness and are cost-effective for concrete protection. Gabril Perfrmailce Products launched GPM-830CB and GPM-890CB thiolamine epoxy curing agents in 2008, which can improve the adhesion between glass and metal, especially bronze and brass. GPM-830CB is a yellow-brown liquid with medium viscosity. The gel time after mixing with liquid bisphenol A epoxy resin is 30 minutes.